磨く技術 | 超精密Ultra Precision Lapping processing

磨く技術-超精密Ultra Precision Lapping processing

What is the lapping process?

The lapping process is a machine operation to achieve a smooth and flat wafer surface by rubbing two surface with a loose abrasive between them. This achieves a high degree of precision in measurement and surface finish. To achieve further precision surface treatment, there is a process developed for using a metal disc coated with diamond powder abrasive.

  • 超精密加工で研磨するUltra Precision Lapping processing
    ■片面ラップ機
  • 摺合せで研磨する精密加工のラッピング
    ■両面ラップ機

We have double-side lapping machines from 18B to 4B in size and can meet our customer’s needs accordingly. We also have single-side lapping machines from 48inches to 15inchs in size and we can process various kinds of materials such as ceramic, metals, glasses, and mono crystalline wafers.

Shinko ManufacturingのOur products Quality and Environmental policy

Youtube Movie

Recruit

Technical words

iso9001・iso14001