磨く技術 | 超精密Ultra precision polishing process

Ultra precision polishing process

The purpose and object of wafer polishing is to make its surface a mirror finish after the lapping process. A soft polisher tool with fine polishing particles (micron and submicron in size) is used for this process. The processing parameter is different but the method used is almost identical to the lapping process. In order to achieve a high quality mirror finish, a diamond powder is used for hard surface polishing and chemical mechanical polish is used for mono crystalline wafers; the polishing process could achieve surface finish with submicron to nanometer roughness.

  • 研磨を行うUltra precision polishing process
    ■両面ポリシング機
  • 超精密な研磨技術で平坦な面に仕上げるポリシング
    ■両面ポリシング機

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iso9001・iso14001