切る技術 | 素材の切断加工

Slicing process

We use a fixed abrasive slicing technology (using Diamond-wire) to produce mono and multi crystalline wafers. We succeed this technology in mass production first in the world. We have 15 machines. To meet our customer’s further increasing volume, we plan to add more machines in the near future. Nowadays the fixed abrasive method is getting to be known widely as the latest technology around the world. This new method is expected to be in further demand for silicon wafer manufacturing in the coming future. We have been successfully achieving over a 95% yield and producing 4.5million silicon wafers per month. As the demand is expected to grow further, we continue our effort for achieving further improvement on products quality and volume.

  • Slicing processを行ったウエハーを自動で検査する最先端機器
    ■固定砥粒用ワイヤーソー
  • ダイヤモンドワイヤーを使った超精密な切断加工
    ■固定砥粒用ワイヤーソー

Shinko ManufacturingのOur products Quality and Environmental policy

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Technical words

iso9001・iso14001