切断技術（Slicing process）・研磨技術（ラッピング・ポリシング）の超精密加工技術を扱うShinko Manufacturing

大阪・岡山・津山の超精密加工会社。研磨・ポリシング・切断、
超精密加工技術・ダイヤモンドワイヤーの技術など

No	name of the equipments	type	quantity of the equipments
1	single machine	48inc	1
2	single machine	32inc	18
3	single machine	24inc	17
4	single machine	18inc	1
5	single machine	15inc	7
6	double sides machine	18B	2
7	double sides machine	17B	1
8	double sides machine	16B	2
9	double sides machine	12B	2
10	double sides polishing machine	9B	11
11	double sides machine	9B	10
12	double sides machine	5B	8
13	double sides machine	4B	4
14	multi wire saw		20	for solar
15	multi wire saw		6
16	band saw		1
17	blade saw		6
18	surface grinder		1
19	vertical axis surface grinder		1
20	high speed centrifugal barrel machine		3
21	rounder processing machine		1
22	rotary grinder		5
23	Outer blade cutting machine		1
24	edge face grinder		2
25	outward form processing machine		1
26	circular cylinder grinder		1
27	precision dicer		1

No	name of the equipments	type	quantity of the equipments
1	wafer thickness and warp	MX203	1
1	measuring machine E＋H company
2	shape of surface roughness	Surftest SV-600	1
	measuring machine			contact type
	Mitsutoyo
3	surface roughness measuring machine	contact system	7
4	laser interferometer	ZYGO	1
5	laser interferometer	Fujinon	2
6	metal microscope	NIKON magnification:1000	2
7	confocal microscope	OLYMPUS	2
8	contactless thickness maesuring machine	KEYENCE	2
9	contactless resistivity/seat resistance	NAPSON	1
	measuring machine
10	contactless P/N checker	NAPSON	1
11	projector	NIKON	1
12	projector	Mitsutoyo	1
13	Auto wafer inspection machine	Yasunaga
14	Laser microscope 3D	KEYENCE	2
15	Scanning electron microscope(SEM)	Hitachi High Tech	1